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BU931ZP DATASHEET PDF

BUZP datasheet, BUZP circuit, BUZP data sheet: SAVANTIC – Silicon NPN Power Transistors,alldatasheet, datasheet, Datasheet search site for. BUZP isc Silicon NPN Power Transistor. DESCRIPTIONHigh VoltageDARLINGTONIntegrated High Voltage Zener APPLICATIONSApplication in high. BUZP from STMicroelectronics, Inc.. Find the PDF Datasheet, Specifications and Distributor Information.

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Type Description Clock Freq. Max output current is 3. Zodiac is almost as fast as pre-diffused arrays but uses the silicon area more effectively. Plastic Datashet — 24,28,40,48 leads. Over types planned. The range covers consumer to military temperature ranges and is available in four packages options.

The case is electrically connected to GND.

BU931ZP Datasheet

Ceramic Pin-grid arrays — 64,68,84, and leads. Matching PWM control circuits may be found on pages 56 to The wide range of complexi- ty of the gate arrays families covers the most important applications. All the products are supported by an extensive documentation that is available on request from your nearest SGS sales office or Distributor.

A logic high level signal applied to this pin dataasheet the module. Binary Counter with Sync.

GND 2 – Ground Common ground of high current path. Individual transistors, diodes, capacitors and resistors can also be integrated. Ceramic Pin-grid arrays — 64,68,84,, and leads. The following represent a small selection from a very wide range. Here below are listed the S6 family products in design at the time of publication; new circuits will be added in the near future. The case of the module is connected to this pin. Lauderdale Orlando Kierulff Datasjeet Ft. Henrique Schaumann – CJ33 Tel.: GNDi – Ground Common ground for input voltage.

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Max 2 HSG 46 2 6 52 2. Power Clock Type Description supply Freq. This pin is connected to case. Zodiac chips are therefore cheap to develop and cheap to produce.

BU931ZP DATASHEET

Firstly there is the traditional antistatic stick commonly used for standard DIP packages. Protection circuitry includes built-in voltage lockout, pulse by pulse limiting and an antimagnetization circuit. Plastic chip carriers — 20,44,68,84 leads. Ceramic DIPs — 24,28,40,48 leads.

BUZP Datasheet pdf – Silicon NPN Power Transistors TO-3PN package – Savantic

SGS also offers packages of almost every type, ranging from the 8-pin small outline micropackage to the lead Multiwatt plastic fatasheet package. This is the optimum solution when small numbers of Gu931zp are being used in mixed surface and through-hole mounting assemblies.

This configuration also has the advantage of reducing the risk of lead bending during shipping — a real problem with standard DIP packages. Max output current is 4 A. Two versions of the CPU are available to match the family to a wide range of target applications from fast process control to large microcomputers. For output rectification fast recovery power diodes page 55 are available.

bu Datasheet PDF, bu

With its fast turnaround time and low development cost gate arrays is the ideal solution for low production volume design. Plastic DIPS — 16,18,20,24,28,40 and 48 leads. Plastic chip carriers — 20,44,68 and 84 leads. These can be acquired through SGS sales network. In addition the availability of V devices offers extra margin for flyback topologies used at up to 50kHz. Factional HP motors are being used for robotics and automated handling.

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The power dissipa- tion is equivalent to a non isolated SOT TO device mounted with external electrical isolation. The SGS range of current capability and choice of packages are second to non. Lauderdale St. These step down regulators shielded for EMI, can provide local on-card regulation, or be used in central power supply systems, in both professional and industrial applications. Their high gain makes them suitable for driving directly by SGS con- trol circuits, see page Where a higher volume of sur- face mounted components is used with fully automated placement equipment, the optimum solution is tape and reel.

The high speed Z80H features 8 MHz clock operation. Pentawatt L Dual Power Op. The chip set is highly integrated, each LSI peripheral device performing an intelligent function; in addi- tion a Universal Peripheral Controller microcomputer and multimicro facilities on the Z CPU chip, enable multi microprocessor system to be realised.

A trr max ns 8. SGS offers a wide variety of packages and both unipolar and bipolar tech- nologies suitable for lamp, motor and solenoid driving as well as the classic alternator regulator func- tion.